Part 50-00-0584-0029

Description

Approvals and Conformities NSN 8040-00-134-2172 Alternate PN#s CHO-BOND 584-29 Product Attributes Country of Origin United States Size 4 fl oz Shipping Weight 0.25 pounds ECCN EAR99 Color Family Silver Manufacturer P/N CHO-BOND 584-29 Schedule B Code 3506.91.0000 Pack Quantity 1 Size 3 oz Polypropylene Kit Color Silver Parker Chomerics 50-00-0584-0029 CHO-BOND® 584-29 Two-Component Highly Conductive Epoxy Adhesive - 4 oz Kit Features Silver filler is a premium conductivity solution to electrical bonding Excellent conductivity levels (0.002 ohm-com) Strong adhesion properties (>1200 PSI lap shear strength) Thin paste makes it effective for easy dispensing from a small needle for small cracks and voids Fast cure at elevated temperatures (15 minutes at 113°C) and room temperature cure options Low volatile organic compounds Comes in standard sizes of pre-measured syringes so no mixing and measuring is required Physical Form: Liquid Quantity Within Each Unit Package: 3.000 Ounces Specific Usage Design: For Bonding Static Discharger Bases To Exterior Aircraft And Also For Creating Conductive Paths On Circuit Boards Or Grounding And Bonding Metal Components Without Welding, Brazing Or Soldering Features Provided: Separate Catalyst Special Features: Silver Filled; Electrically Conductive; Volume Resistivity 0.003 Ohm/Cm Material: Plastic Epoxy Supplementary Features: 3 Ounce Kit Nondefinitive Spec/Std Data: 2 Type Downloads