Part 50-02-0584-0029

Description

Approvals and Conformities NSN 8040-01-031-9656 Product Attributes Country of Origin United States Size 2.5 Gram Shipping Weight 0.25 pounds ECCN EAR99 Manufacturer P/N CHO-BOND 584-29 Schedule B Code 3506.91.0000 Pack Quantity 1 Size 2.5 Gram CHO-PAK When precision matters and conductivity can’t be compromised, reach for CHO-BOND® 584-29 Two-Component Conductive Epoxy Adhesive from SkyGeek. This silver-filled adhesive will maintain conductivity along with a strong bond, ensuring maximum performance in challenging conditions. Designed for demanding EMI shielding and grounding applications, the high-performance adhesive holds strong Gand delivers superior electrical conductivity in a compact 2.5-gram CHO-PAK®. Whether you're working on sensitive electronics, aerospace components or critical enclosures, this epoxy delivers both reliability and convenience in one neat package.Engineered for low outgassing and strong adhesion to a variety of substrates, CHO-BOND® 584-29 from SkyGeek is ideal for bonding conductive gaskets, sealing seams or creating an electrically conductive path between metal surfaces. Its silver content provides consistent conductivity, while the two-part formulation ensures a robust, long-lasting bond. Easy to mix and apply, this epoxy is a favorite among engineers who need both performance and precision in compact, mission-critical applications. Downloads Safety Data Sheet